• Inventors:
  • Assignees:
  • Publication Date: January 09, 2001
  • Publication Number: US-6171980-B2

Abstract

Claims

Description

Topics

    Download Full PDF Version (Non-Commercial Use)

    Patent Citations (0)

      Publication numberPublication dateAssigneeTitle

    NO-Patent Citations (0)

      Title

    Cited By (6)

      Publication numberPublication dateAssigneeTitle
      US-2003080360-A1May 01, 2003Samsung Electronics Co., Ltd.Wafer treatment method for protecting fuse box of semiconductor chip
      US-2006008660-A1January 12, 2006Applied Materials, Inc.Cleaning of a substrate support
      US-2010136218-A1June 03, 2010Applied Materials, Inc.Cleaning of a substrate support
      US-6841425-B2January 11, 2005Samsung Electronics Co., Ltd.Wafer treatment method for protecting fuse box of semiconductor chip
      US-7655316-B2February 02, 2010Applied Materials, Inc.Cleaning of a substrate support
      US-8114477-B2February 14, 2012Applied Materials, Inc.Cleaning of a substrate support